A variety of system software packages enable Reedholm test systems to satisfy the different semiconductor test applications they are used for. This includes:
Several of the packages described below also interact. For example, Build is used to to build test plans, which are then executed in an automated fashion in Acquire and with Reliability experiments. Also, additional software is delivered for system maintenance, including: calibration, diagnostics, troubleshooting, direct instrumentation control, etc.
At this time, only datasheets for DOS versions of the applications are available. However, newer Intranet (Windows) versions exist that not only match, but exceed, all of the capabilities of the DOS versions.
Acquire provides production operator interface and control of automatic probers. The Acquire application is also used to setup the die and intradie probing patterns for the wafers; this includes which tests to run at each probe site.
Test result reports are provided either electronically or in hardcopy. These reports can include raw test results by site and/or summarized results of the testing. Test result data files are stored in ASCII files, but can optionally be converted into dBaseIV format and imported into databases and/or spreadsheet programs such as Excel.
For a complete copy, see Acquire Datasheet (65kB, PDF).
Compared to the DOS version, the Intranet version only handles the automated probing, with a variety of user lot start screens. different screens are used to handle split lots, single wafer lots, etc. The Intranet version also has numerous features, including probe card and touchdown tracking, advanced error handling, and optional real-time display of test results.
As with every aspect of the Intranet product, all of the test results are automatically stored in the Reedholm SQL database. During testing, Acquire can also call integrated and user expandable data reports created using Crystal Reports Developer.
For more information, please contact Reedholm.
Build is a combination of parts of the DOS EMPAC, EMAGE, and Acquire applications. It is used to create all test plans, probe patterns, device libraries, probe setups, etc.-- all of which are stored in the Reedholm SQL database. Build has been expanded to include many new features, including: graphical die and intradie pattern editors, master test list, advanced schematics for each test, new equation editor, separate limit tables, integrated product version control, etc.
For more information, please contact Reedholm.
ChargeScope is used to program, measure, and analyze CHARM wafers, which are used to monitor and study process induced damage. It also handles everything associated with using CHARM wafers, including a database to track each wafer's usage and lifetime. Finally, ChargeScope can be used to perform incoming inspection on CHARM wafers.
For a complete copy, see ChargeScope Datasheet (67kB, PDF).
EMAGE is used for device characterization and troubleshooting. Used for both sweep test plan creation and plotting of curve data. Outputs are in the form of I-V, C-V, V-T, and I-T plots. More complex plots of transistor characterization for MOSFETs, MESFETs, and bipolar technologies for both n and p material are also available--along with plots of single cell non-volatile memory wear-out and disturb effects. Plotting portion allows for digitization of individual points, tangents, overlaying plots, changing scales, and running equations for normalization and/or alteration of data.
For a complete copy, see EMAGE Datasheet (90kB, PDF).
Used to create test plans where one data point is returned per test. In the many cases where a single test returns multiple values, such as WLR, the subsequent values are obtained from memory and returned as their own parameters. The test lists can be small (5 - 10 parameters) or large (5,000 - 10,000 parameters). EMPAC has a rich library of built-in tests, but the library can be extended by the user. Each unique test has a wide range of options, making it useable for many types of test structures and processing technology.
For a complete copy, see EMPAC Datasheet (74kB, PDF).
EMREL is the interactive software tool used for configuring and monitoring long term reliability experiments. In addition, it is used to generate output reports, both tabular and graphical. This includes reprocessing test data using different failure limits, resulting in new distributions.
Typical qualifications or monitoring tests contain many simultaneous experiments, each consisting of 20 or more devices being subjected to different electrical and temperature stresses. Typically, three different temperature and three voltage or current stresses are employed per qualification. Thus, EMREL is designed to handle controlling anywhere from 1 to 36 active experiments, depending upon test system type and configuration.
For more information, please contact Reedholm.
Examine is a combination of the graphical parts of the DOS EMAGE and GrafPAC applications and the DOS Acquire text reports. It is used to examine, both graphically and textually, all test data generated and stored in the Reedholm SQL database. This includes Acquire production data, Build characterization plots, and RelTest experiment data.
The graphical plots include I/V curves, wafer maps, scatter plots, trend charts, lognormal plots, histograms, etc. The text reports are actually electronic reports generated by the Crystal Report engine integrated into the RDS Intranet product. Delivered reports can be copied and modified or replaced. The product can also be expanded upon with additional reports meeting any operational needs. Other features include advanced plot manipulation and graphing, such as 3D wafer map rotation and saving plots to JPEG files.
For more information, please contact Reedholm.
GrafPAC is used to present EMPAC test data taken with Acquire in graphical form. The available plot types include histograms, wafer maps, scatter plots, and trend charts. Features include filters and lists in order to isolate data and reduce the number of tests trended. Plotting of EMREL reliability data is handled with EMAGE.
For a complete copy, see GrafPAC Datasheet (99kB, PDF).
RelTest is the interactive software tool used for configuring and monitoring long term reliability experiments. In addition, it is used to massage data and reprocess test data using different failure limits, resulting in new distributions. Results and plots are viewed using Examine.
Typical qualifications or monitoring tests contain many simultaneous experiments, each consisting of 20 or more devices being subjected to different electrical and temperature stresses. Thus, RelTest is designed to handle controlling anywhere from 1 to 36 active experiments, depending upon test system type and configuration.
For more information, please contact Reedholm.
Performance of integrated circuits containing analog elements is often dependent on low temperature coefficient of resistance (TCR) resistors. Since TCR is seldom constant over the operating temperature range of an integrated circuit, measurements are needed to assure compliance over a wide span of temperatures. For this and several other reasons, Reedholm′s optional self-heated test structure is ideally suited for TCR measurements since it:
For a complete copy, see TCR Datasheet (101kB, PDF).
The optional Fast WLR test routines augment the standard EMPAC or Build routines and are designed for specific test structures, which Reedholm can also provide. The routines provide the shortest possible test times, while accelerating the primary failure mechanisms. Careful control of the stress variables and the ability to trap any possible error condition provide high quality test results. Extensive graphical outputs are provided during initial test setup in order to evaluate test structures and conditions.
The word "fast" is a relative term. A fast WLR test might take 60 seconds to execute. This does not compare to normal e-test parameters, which might take 6ms, but is far shorter than package or wafer level reliability testing in thermal chambers or on thermal chucks, which might take hours, days, weeks, or even months.
For a complete copy, see WLR Test Routines Datasheet (62kB, PDF). , WLR Test Structures Datasheet (256kB, PDF).